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It’s much easier to apologize than it is to get permission’’) the community must continue to innovate with open minds for if we constrain our vision for MEMS in space, an opportunity may be missed to bend (or even break) current space platform design and production paradigms. REFERENCES 1. L. L. , Microelectromechanical devices for satellite thermal control, IEEE Sensors Journal Microsensors and Microacuators: Technology and Applications 4(4), pp. 525 (2004). 2. L. A. , A micro-machined flat plasma spectrometer (FlaPS), Proceedings of SPIE — The International Society for Optical Engineering 5344, pp.
KOH etches 100 times faster in the (1 0 0) direction than the (1 1 1) direction. Patterned silicon dioxide can be used as an etch mask for these types of etches. 4. 7 8) that can be etched in silicon. 2 lists some of the common etchants for crystalline silicon and their selectivity. If there are no etch stops in a wet-etching process the two options available to the process engineer are a timed etch or a complete etch through the material. A timed etch is difficult to control accurately due to the many other variables in the process such as temperature, chemical agitation, purity, and concentration.
1 shows the basic concepts of each fabrication category. Bulk micromachining and sacrificial surface micromachining are frequently silicon based and are generally very synergistic to the microelectronics industry since they tend to use common tool sets. Bulk micromachining utilizes wet- or dry-etch processes to produce an isotropic or anisotropic etch profile in a material. Bulk micromachining can create large MEMS structures (tens of microns to millimeters thick) that can be used for applications such as inertial sensing or fluid flow channels.